Availability: | |
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Quantity: | |
Application
Vacuum application
Laboratory and research and development
Semiconductor industry
Vacuum packaging
Plasma etching process equipment
Application
Vacuum application
Laboratory and research and development
Semiconductor industry
Vacuum packaging
Plasma etching process equipment
Features
Features
Technical Parameters
Measuring Range | |||||||||
Absolute(kPa) | Rated pressure | 0.2 | 0.5 | 1 | 2 | 5 | 10 | 20 | 100 |
Overload | 200 | 200 | 200 | 200 | 400 | 400 | 600 | 1000 | |
Absolute(Torr) | Rated pressure | 2 | 5 | 10 | 20 | 50 | 100 | 200 | 1000 |
Overload | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 6000 | 10000 | |
Absolute(mbar) | Rated pressure | 2 | 5 | 10 | 20 | 50 | 100 | 200 | 1000 |
Overload | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 6000 | 10000 | |
Note: For other measuring ranges, please contact us. |
Measuring Medium | Various gases compatible with contact materials |
Pressure Range | 0~2Torr…1000Torr |
Accuracy | ±0.1%FS,±0.25%FS,±0.5%FS(subject to measuring range) |
Working Temperature | -40~85℃ |
Supply Voltage | 10~30VDC 8.5~30 VDC 12~30VDC 10~30VDC (subject to output) |
Output Signal | 4~20mADC, voltage,RS485 |
Technical Parameters
Measuring Range | |||||||||
Absolute(kPa) | Rated pressure | 0.2 | 0.5 | 1 | 2 | 5 | 10 | 20 | 100 |
Overload | 200 | 200 | 200 | 200 | 400 | 400 | 600 | 1000 | |
Absolute(Torr) | Rated pressure | 2 | 5 | 10 | 20 | 50 | 100 | 200 | 1000 |
Overload | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 6000 | 10000 | |
Absolute(mbar) | Rated pressure | 2 | 5 | 10 | 20 | 50 | 100 | 200 | 1000 |
Overload | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 6000 | 10000 | |
Note: For other measuring ranges, please contact us. |
Measuring Medium | Various gases compatible with contact materials |
Pressure Range | 0~2Torr…1000Torr |
Accuracy | ±0.1%FS,±0.25%FS,±0.5%FS(subject to measuring range) |
Working Temperature | -40~85℃ |
Supply Voltage | 10~30VDC 8.5~30 VDC 12~30VDC 10~30VDC (subject to output) |
Output Signal | 4~20mADC, voltage,RS485 |
Application
Vacuum application
Laboratory and research and development
Semiconductor industry
Vacuum packaging
Plasma etching process equipment
Features
Technical Parameters
Measuring Range | |||||||||
Absolute(kPa) | Rated pressure | 0.2 | 0.5 | 1 | 2 | 5 | 10 | 20 | 100 |
Overload | 200 | 200 | 200 | 200 | 400 | 400 | 600 | 1000 | |
Absolute(Torr) | Rated pressure | 2 | 5 | 10 | 20 | 50 | 100 | 200 | 1000 |
Overload | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 6000 | 10000 | |
Absolute(mbar) | Rated pressure | 2 | 5 | 10 | 20 | 50 | 100 | 200 | 1000 |
Overload | 2000 | 2000 | 2000 | 2000 | 4000 | 4000 | 6000 | 10000 | |
Note: For other measuring ranges, please contact us. |
Measuring Medium | Various gases compatible with contact materials |
Pressure Range | 0~2Torr…1000Torr |
Accuracy | ±0.1%FS,±0.25%FS,±0.5%FS(subject to measuring range) |
Working Temperature | -40~85℃ |
Supply Voltage | 10~30VDC 8.5~30 VDC 12~30VDC 10~30VDC (subject to output) |
Output Signal | 4~20mADC, voltage,RS485 |